And uniform temperature panels packing structure, excellent thermal properties, easy controlling LED temperature, LED life assurance, COB packaging without Lead Frame, the cost structure is superior to Ceramic substrates, heat capacity far beyond the ceramic substrate.
1. meet Tj<80 ℃ on heat transfer characteristics of chip specifications, mass production of strictly controlled within a reasonable range.
2. the LED module heat transfer enhancement capabilities, narrowing the Tj temperature difference between the radiator and cost competitive.
3. have the overall lighting design capabilities, total system solution is complete.
4. the substrate material of choice, overall carrier boards reflects light reaching the highest efficiency.
5. substrate design and packaging process control insulation voltage specification of 2.2KV.